Thermographic analysis of heating and cooling properties is the resource of choice for checking and optimising the thermal properties of electronic components and circuits. However, only high-quality thermal imagers can meet the challenges in electronics – with optimum thermal sensitivity and the possibility of recording radiometric video sequences.
The challenge
Even tiny components can generate a lot of heat on densely packed circuit boards in modern electronic equipment and thus impair the function of adjacent assemblies or even the whole circuit. In particular, continuous heat generation over a long period of time can have a negative effect on the functional capability and service life of a device. Quality assurance in electronics is therefore dependent on the design of the circuit board layout and the positioning of the components ensuring that the heat which arises can be dissipated effectively at all times.